China Wafer Level CSP Co Ltd - ESG Rating & Company Profile powered by AI
The assessment of China Wafer Level CSP Co Ltd uses data points from across the internet and also from available disclosures by China Wafer Level CSP Co Ltd. Browse to the end of this webpage for potential risks for China Wafer Level CSP Co Ltd based on sector, geography and size. The page contains a questions and answers section for China Wafer Level CSP Co Ltd.
China Wafer Level CSP Co Ltd in the Semiconductors industry gained a UN SDG ESG Transparency Score of 0.0; made up of an environmental score of 0.0, social score of 0.0 and governance score of 0.0.
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Peer Group Comparison
| Rank | Company | SDG Transparency Score ⓘ | Performance |
|---|---|---|---|
| 1 | Atmel Corp | 8.0 | High |
| 1 | Avi Tech Electronics Ltd | 8.0 | High |
| ... | ... | ... | |
| 285 | Yangzhou Yangjie Electronic Technology Co Ltd | 0.4 | Low |
| 297 | Maxim Integrated Products Inc | 0.3 | Low |
| 298 | China Wafer Level CSP Co Ltd | 0.0 | Low |
| 298 | Cambricon Technologies Corp Ltd | 0.0 | Low |
| 298 | Champion Microelectronic Corp | 0.0 | Low |
| 298 | iCatch Technology Inc | 0.0 | Low |
| 298 | uPI Semiconductor Corp | 0.0 | Low |
| ... | ... | ... |
Frequently Asked Questions
Does China Wafer Level CSP Co Ltd have an accelerator or VC vehicle to help deliver innovation?
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Subscription requiredAre emissions metrics verified by STBi?
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Potential Risks for China Wafer Level CSP Co Ltd
These potential risks are based on the size, segment and geographies of the company.
China Wafer Level CSP Co., Ltd. provides wafer level miniaturization technologies and processes for the electronics industry. It offers image sensor, biometric identification, and ambient light sensor chips, as well as medical electronic devices and automotive sensors. The company also provides infrastructure solutions, including design, test, and logistics; design chain management; design for manufacturing; design for cost; full design and verification of WL, leadframe, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services. In addition, it offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives; and FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. The company serves consumer, computing, communication, and medical markets. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.