Kinsus Interconnect Technology CorpKinsus Interconnect Technology Corp - ESG Rating & Company Profile powered by AI

Industry Group:Semiconductors

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Kinsus Interconnect Technology Corp in the Semiconductors industry gained a UN SDG ESG Transparency Score of 4.0; made up of an environmental score of 3.4, social score of 3.0 and governance score of 5.7.

SDG Transparency Score for Kinsus Interconnect Technology Corp 
Low
0 - 3

4.0

Medium Impact
4 - 6
High
7 - 10
Last Score Update: 2023-07-01
What drives the score for Kinsus Interconnect Technology Corp 
3.4

Environmental

3.0

Social

5.7

Governance

Detailed ESG Breakdown
SEVVA Platform offers unique drill down to the underlying sources powering the ratings. Break down your ESG analysis by 17 UN SDGs and 8 additional governance factors.

Peer Group Comparison

RankCompanySDG Transparency Score Performance
1Analog Devices Inc
8.6
High
2Qualcomm Inc
8.4
High
193Synaptics Inc
4.1
High
193Shenzhen Baoming Technology Co Ltd
4.1
High
199Kinsus Interconnect Technology Corp
4.0
High
199Golden Century International Holdings Group Ltd
4.0
High
199LONGi Green Energy Technology Co Ltd
4.0
High
.........
485Youngtek Electronics Corp
0.0
Low
485uPI Semiconductor Corp
0.0
Low
.........
View the full peer group of 583 companies on the SEVVA platformSign up for free
Peer Companies Benchmark
SEVVA Platform benchmarks each company against a peer group. View the full score distribution for peers by logging into SEVVA

Frequently Asked Questions

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Potential Risks for Kinsus Interconnect Technology Corp
These potential risks are based on the size, segment and geographies of the company.

Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and WiFi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company provides PCBs and related products, and electronic parts and components, as well as after sales services. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. Kinsus Interconnect Technology Corp. was incorporated in 2000 and is headquartered in Taoyuan City, Taiwan.

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