Kinsus Interconnect Technology CorpKinsus Interconnect Technology Corp - ESG Rating & Company Profile powered by AI

Industry Group:Semiconductors

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Kinsus Interconnect Technology Corp in the Semiconductors industry gained a UN SDG ESG Transparency Score of 0.0; made up of an environmental score of 0.0, social score of 0.0 and governance score of 0.0.

SDG Transparency Score for Kinsus Interconnect Technology Corp 

0.0

Low Impact
0 - 3
Medium
4 - 6
High
7 - 10
Last Score Update: 2024-05-01
What drives the score for Kinsus Interconnect Technology Corp 
0.0

Environmental

0.0

Social

0.0

Governance

Detailed ESG Breakdown
SEVVA Platform offers unique drill down to the underlying sources powering the ratings. Break down your ESG analysis by 17 UN SDGs and 8 additional governance factors.

Peer Group Comparison

RankCompanySDG Transparency Score Performance
1Atmel Corp
8.0
High
1Avi Tech Electronics Ltd
8.0
High
.........
285Yangzhou Yangjie Electronic Technology Co Ltd
0.4
Low
297Maxim Integrated Products Inc
0.3
Low
298Kinsus Interconnect Technology Corp
0.0
Low
298Cambricon Technologies Corp Ltd
0.0
Low
298Champion Microelectronic Corp
0.0
Low
298iCatch Technology Inc
0.0
Low
298uPI Semiconductor Corp
0.0
Low
.........
View the full peer group of 583 companies on the SEVVA platformSign up for free
Peer Companies Benchmark
SEVVA Platform benchmarks each company against a peer group. View the full score distribution for peers by logging into SEVVA

Frequently Asked Questions

Does Kinsus Interconnect Technology Corp have an accelerator or VC vehicle to help deliver innovation?

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Does Kinsus Interconnect Technology Corp reference operational or capital allocation in relation to climate change?

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Does Kinsus Interconnect Technology Corp disclose its ethnicity pay gap?

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Does Kinsus Interconnect Technology Corp disclose cybersecurity risks?

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Does Kinsus Interconnect Technology Corp have a long term incentive (LTI) executive compensation plan based on a measure of return on capital?

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Does Kinsus Interconnect Technology Corp disclose the number of employees in R&D functions?

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Is executive remuneration linked to climate performance?

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Does Kinsus Interconnect Technology Corp disclose current and / or historical scope 2 emissions?

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Has Kinsus Interconnect Technology Corp issued a profit warning in the past 24 months?

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Does Kinsus Interconnect Technology Corp disclose parental leave metrics?

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Does Kinsus Interconnect Technology Corp disclose climate scenario or pathway analysis?

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Does Kinsus Interconnect Technology Corp disclose current and / or historical scope 1 emissions?

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Are Operating Expesnses linked to emissions reduction?

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Does Kinsus Interconnect Technology Corp disclose the pay ratio of women to men?

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Does Kinsus Interconnect Technology Corp support suppliers with sustainability related research and development?

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Does Kinsus Interconnect Technology Corp disclose the number of operations that have been subject to human rights reviews or human rights impact assessments?

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Does Kinsus Interconnect Technology Corp reflect climate-related risks in its financial statements?

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Is there a statment that there is no plan to expand their carbon intensite energy assets? (for example: 'We have no current plans to carry out further drilling for oil,')

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Does Kinsus Interconnect Technology Corp disclose energy use targets?

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Does Kinsus Interconnect Technology Corp disclose its Renewable Energy targets?

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Potential Risks for Kinsus Interconnect Technology Corp
These potential risks are based on the size, segment and geographies of the company.

Kinsus Interconnect Technology Corp. manufactures and sells electronic products in Taiwan and internationally. It operates through three segments: IC Substrate, Printed Circuit Board (PCB), and Optics. The company offers system in package, a carrier substrate that provides a platform for multiple chips or packages or passive components assembly for modules in handset and wearable devices; plastic ball grid array substrate for microprocessors, controllers, graphic processors, ASIC, and PC chipsets; and flip chip chip scale package substrate for application processors and connectivity applications. It also provides wire bond chip scale package substrate for application processor, connectivity, power management, and memory applications; radio frequency modules substrate for power amplifier, front end modules, and WiFi connectivity modules applications; and flip chip ball grid array substrate for micro and graphic processors, ASIC, and field programmable gate array applications. In addition, the company provides PCBs and related products, and electronic parts and components, as well as after sales services. Further, it is involved in the wholesale and retail-sale of electronic materials; manufacture and sale of medical equipment; provision of consultation services for business operation and management; investment and trading activities; and sale of cosmetic products. Additionally, the company produces, manufactures, and sells contact lens. It primarily serves manufacturers of electronic products. Kinsus Interconnect Technology Corp. was incorporated in 2000 and is headquartered in Taoyuan City, Taiwan.

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